Shanglin Science and Technology

Morphological difference between conductive silver paste and conductive silver glue

conductive silver paste:A viscous paste consisting of a mechanical mixture of high-purity (99.9 percent) metallic silver particles, a binder, a solvent, and additives. The conductive silver paste generally contains a solvent.

conductive silver glue:Also called conductive adhesive, is composed of conductive filler and silver copper, cured or dried with a certain conductive properties of the adhesive, it is usually based on the matrix resin and conductive filler that is conductive particles as the main component, through the bonding of the matrix resin The conductive particles are combined together to form a conductive path to achieve conductive connection of the adhesive material. Since the matrix resin of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for bonding. For example, epoxy resin adhesive can be cured at room temperature to 150 ℃, which is much lower than the welding temperature above 200 ℃ for tin-lead welding, thus avoiding the formation of material deformation, thermal damage and internal stress of electronic devices that may be caused by high welding temperature. At the same time, due to the rapid development of miniaturization and miniaturization of electronic components and high density and high integration of printed circuit boards, the minimum pitch of 0.65mm of lead-tin welding is far from meeting the actual needs of conductive connections, while conductive adhesives can be made into paste to achieve high line resolution. Moreover, the conductive adhesive process is simple and easy to operate, which can improve production efficiency and avoid environmental pollution caused by heavy metal lead in tin-lead solder. Therefore, conductive adhesive is an ideal choice for replacing lead-tin welding and realizing conductive connection.

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Morphological difference between conductive silver paste and conductive silver glue

Conductive silver paste: A viscous paste of a mechanical mixture of high-purity (99.9 percent) metallic silver particles, binders, solvents, and additives. The conductive silver paste generally contains a solvent.