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Two-component adhesive stick

Two-component, fast curing · High bonding strength, wide bonding · Rapid degumming in warm water at 50-85 ℃ · Safety and environmental protection · Suitable for silicon wafers, wafers, glass, ceramics, lenses, gems and other temporary fixed processing


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Classification:

Gem cutting glue

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Key words:

UV light curing class

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Description


Two-component, fast curing
· High bonding strength, wide bonding
· Rapid degumming in warm water at 50-85 ℃
· Safety and environmental protection
· Suitable for silicon wafers, wafers, glass, ceramics, lenses, gems and other temporary fixed processing
 

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