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One-component epoxy structural adhesive with high thermal conductivity

· Used for heat sink and non-insulated heat conduction occasions · One-component, can be automated dispensing or printing process · Low viscosity, good fluidity · High bonding strength, impact resistance and fall resistance · Excellent weather resistance


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Classification:

Epoxy structural adhesive

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Key words:

UV light curing class

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Description


· Used for heat sink and non-insulated heat conduction occasions
· One-component, can be automated dispensing or printing process
· Low viscosity, good fluidity
· High bonding strength, impact resistance and fall resistance
· Excellent weather resistance

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