Epoxy conductive silver adhesive
· Excellent electrical and thermal conductivity · Medium and low temperature fast curing · High bonding strength · Lower viscosity and excellent thixotropy · Good dispensing process performance Suitable for silver-plated bracket, printed circuit board substrate, chip bonding, electrode extraction, RF component bonding, etc.
Classification:
Epoxy conductive silver adhesive
Key words:
UV light curing class
Telephone:
E-mail:
E-mail:
Description
· Excellent electrical and thermal conductivity
· Medium and low temperature fast curing
· High bonding strength
· Lower viscosity and excellent thixotropy
· Good dispensing process performance
Suitable for silver-plated bracket, printed circuit board substrate, chip bonding, electrode extraction, RF component bonding, etc.
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E-mail:qianml@zjshanglin.com
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