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Electromagnetic shielding conductive adhesive (Ni-C)

· Excellent EMI shielding performance,>90dB shielding effectiveness Fast curing, surface curing can be completed after 4H at room temperature · FIP automatic system dispensing · Super soft, compressible, reduced deflection force · Save raw materials, labor and assembly man-hours · Exempt high mold fees and support fast proofing Suitable for communication base stations, PDA, microwave, mobile phones and other products


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Classification:

Electromagnetic shielding conductive adhesive (Ni-C)

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Key words:

UV light curing class

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Description


· Excellent EMI shielding performance,>90dB shielding effectiveness
Fast curing, surface curing can be completed after 4H at room temperature
· FIP automatic system dispensing
· Super soft, compressible, reduced deflection force
· Save raw materials, labor and assembly man-hours
· Exempt high mold fees and support fast proofing
Suitable for communication base stations, PDA, microwave, mobile phones and other products

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